IBM cools 3D chips with integrated water channels

IBM cools 3D chips with integrated water channels
Why cool semiconductors with liquid on the surface when you can run water right through them? IBM believes that “tiny rivers of water” within stacked chips may not only advance Moore’s Law, but also pave the way to “green data centers”, significantly reducing the energy requirements by computers.

Frostytech Covers the Heatsinks of Computex 2008
[Frostytech.com]

This year Computex expands into the new Nangang exhibition building in Taipei, promising an even more exciting event as the worlds largest computer brands and manufacturers come together in one location for 4 days of PC hardware tech goodness! Frostytech will be covering the cooling angle from lovely (and very Hot) Taipei. See you there!

Comments